Feng Lai has served as our Chairperson since the establishment of ChipSiP in 2002. ChipSiP is addressing the developing demand for multimedia, computing, mobile devices and smart home market with its two major solution lines, which are offered by Logic SiP Division and Wireless Communications Division. With the knowledge of wafers and integration resources, ChipSiP devotes all efforts to delivering the values of SiP technology in order to support digital consumer electronics, portable devices, wireless and communication application fields, to provide communications on the go and realize a convenient, smart life.
Logic SiP Div.
ChipSiP started as a provider of integrated memory solutions, and now prides itself in powerful wafers as well as hardware and software integration resources. We provide one-stop-shopping services from design, packaging and testing, and verification. We are specialized in miniaturization technology, which can achieve the flexibility and product value in the market, and also increase more valuable space in terminal devices. Logic SiP Division has built abundant resources on components and industry chain to solve the inconveniences in purchase and inventory managementfor customers.
Wireless Communications Div.
RF SiP products are composed by SiP component, which is easy to be shrunk in system products and to proceed quantity production for customers. Wireless Communications Division offers wireless functions of WiFi, Bluetooth, GPS, ZigBee and WiMax ,and enables to design RF modules with better performance, greater flexibility and ease of use. With ChipSiP’s customized SiP standardized procedure, the individual customers can shorten design cycle and accelerate time-to-market at competitive prices.