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1 2008/05/07 Announced 9x9mm Memory MCP
2 2008/04/18 Cadence SiP Design Forum
3 2008/03/19 PIE (Photo Image Expo) 2008
4 2008/03/15 The provider of SiP integration from component to system
5 2007/10/18 eMex China 2007
6 2007/10/09 KES 2007
7 2006/12/13 ChipSiP launches DSC/Camera module/Mobile Phone MCP solutions
8 2006/08/17 EDAT 14th Annual EDA & T
9 2006/07/05 ChipSiP signed Korean agency contract with HanChang
10 2006/06/06 2006 Computex Taipei
 
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