ChipSiP Technology has announced a 9x9x1.2mm Memory MCP which designed for ultra-slim type and multi-function digital still cameras (DSC) that aim to meet the miniature trend. With rich know-how of Memory MCP and SiP technology, ChipSiP has designed win 10x13mm MCPs into worldwide DSC brands through Tawain ODM makers since 2006. The shipment of 2007 accounted for 3 million PCs and will increase to 15 million PCs in 2008 by new projects proceeding and increasing small size requirement from customers.
Shrinking dimension and more features integrated simultaneously is the mainstream to handheld multimedia products in consumer market. ChipSiP dedicates in developing smaller Multi-Chip Package via advanced SiP technology to lead customer forward while requiring more design space and creativity. CT48 Memory MCP which combined NAND Flash and DDRII SDRAM shrinked to 9x9mm; saves 40% space than 10x13mm MCP.
ChipSiP unveiled its latest MCP products and DSC design win models in PIE(Photo Imaging Expo) show at Tokyo this March and got many customers’ enquiries. From April, DSC makers from Japan, Korea and Taiwan enter sample verify stage and will mass production next month. ChipSiP will also join Computex Taipei 2008 in June (Booth No.: A1104, TWTC Hall 1) to introduce more MCP & SiP ODM services.