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News & Event
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| 2009 「ChipSiP SiP design forum 」seminar |
2009-04-07 |
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.jpg) In recent years, SiP technology is gradually becoming engineering design mainstream because of its potential to integrate different ICs in one package with cost effective and short design cycle. ChipSiP aims to assist customers, including IC design houses and system development manufacturers, accomplish multi-functional and miniaturizing design simply by our expertise in SiP.
"2009 ChipSiP SiP design forum" will take place in Taipei on May 14. We sincerely invite you to realize how SiP technology brings key value and innovation to you.
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