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Products
>> Memory MCP |
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ChipSiP Core Value
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ChipSiP, whose primary focus is SiP solution, has developed various solutions of memory MCP for digital devices, such as DSC, DV, Smart phone, Feature phone and GPS. With the demands of miniature and system integration, ChipSiP’s mission is to consistently innovate advanced memory MCP solution and create value chain in SiP industry.
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Advantage of ChipSip Memory MCP
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● Customized Design
ChipSiP has developed a series of standard memory MCP products. Unlike IDM companies, ChipSiP is a fabless designer and is more flexible on wafer resources. Therefore, ChipSiP can provide customized design according to customers' requirement.
● System Integration
The complexity designing memory MCP is in system integration. ChipSiP has cultivated in developing memory MCP and accumulated much experience in designing memory MCP for mobile phone and DSC platform.With ChipSiP's support in system integration it will be easy for engineers to design.
● Modulization
With designing ChipSiP memory MCP, it will be easily to manage product life cycle. Using modulization concept to shorten product design schedule.
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A Leader to Provide MCP Solution
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In May.08, ChipSiP was the world's first to announce the form factor 9x9mm MCP of Nand flash+DDR/DDRII. To satisfy customers requirement of more design space and flexibility, ChipSiP keeps developing outstanding MCP and being the leader in MCP industry.
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ChipSiP MCP Benefits
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Product design with ChipSiP MCP gives you below benifits:
1.Save BOM cost
2.Simplify design process
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MCP Resources
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ChipSiP provides various combinations of Memory MCP. With strong memory resources, we can offer different density and flexible combinations. ChipSiP can design customized MCP products according to customer's request.
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