CS8140 Single WiFi b/g/n SiP

Ø           Small form factor Package : 9 mm x 9 mm x 1.3 mm (MAX)

Ø           Support for IEEE 802.11b/802.11g

Ø           IEEE 802.11n support, including MPDU and MSDU aggregation, immediate block acknowledgement, PSMP and STBC

Ø           Multiple power saving modes to maximize battery life

Ø           Supports advanced WiFi-Bluetooth co-existence on antenna sharing capability and VoIP optimizations

Ø           Cellular phone radio non-interference

Ø           QoS Packet prioritization for time sensitive payload

Ø           Full support for IEEE 802.11, WFA WPA®/WPA2® and WAPI security

CS8150 GPS SiP

Ø           Small form factor Package : 8 mm x 8 mm x 1.3 mm (MAX)

Ø           -163dBm high tracking sensitivity

Ø           48 track verification channels

Ø           Only 2mA maintains hot start capability

Ø           <10mW required for TricklePower™ mode

Ø           Geo-tag information

Ø           Smart sensor I²C interface

Ø           Host I²C, SPI and UART supported

Ø           GSM/GPRS/DCS/PCS/WCDMA/WLAN/Bluetooth radio non-interference

Application

Advantages of ChipSiP RF SiP

     ● Parallel design process to speed up design cycle.
     ● Utilize various packaging technologies into one. (FR-4, BT, LTCC, Wire-Bond, Flip-Chip, ….)
     ● Easier to assemble and repair.
     ● Better RF and EMI shielding.
     ● Higher flexibility for module allocation.
     ● Lower the difficulties of system module maintenance.
     ● Overcome the bottleneck of Multi-Frequency integration design.
     ● Function modulized for easier replacement.
     ● Higher yield rate, lower yield loss cost.

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