A. LF-PoP (Low Profile & Fine Pitch - PoP)
● Advantage: The smaller ball pitch and package size than PoP.
B. PoP (Package on Package)
● Advantage: Easy to test and verify, and lower yield loss.
● Disadvantage: The higher assembly cost and tooling cost.
C.PiP (Package in Package)
● Advantage: Package cost lower than PoP.
● Disadvantage: Yield control not easy, need to choose KGD (Known Good Die). The higher wafer cost.
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